Undergraduate Research at NYIT

With funding by the National Science Foundation, the Research Experiences for Undergraduate (REU) Program at New York Tech is recruiting ten undergraduate students to conduct research with our faculty on methods of securing mobile devices and wireless networks using both software and hardware approaches for 10 weeks during the summer (June 1 - August 6, 2021) at the New York Institute of Technology NYC campus, located in the heart of New York City near Columbus Circle at the southwest corner of Central Park.

Participating students will get $6,000 stipend, $600 travel allowance, $3,000 housing (estimated) and $24/day (estimated) food allowance PLUS research experiences, grad school preparation, networking/mentoring opportunities, and visits to state-of-the-art labs, security centers, and corporations.

The application for REU at New York Tech is now available!

Free School & Student Resources from Simpson Strong-Tie - February 11 Webinar

 Learn about resources from Simpson Strong-Tie for you and your students, along with our student scholarship and fellowship programs, at our short webinar on February 11.

 

Who: University representatives and staff

When: Thursday, February 11 from 10-10:30 am PST

Where: Register here for the webinar. After registering, you will receive a confirmation email containing information about joining the webinar.

 

Simpson Strong-Tie has numerous resources for schools and students participating in our scholarship program for architecture, civil/structural engineering and construction management majors.

 

Along with providing scholarship winners with $2,000 toward their degree, we offer free resources including a one-week trip to Simpson Strong-Tie headquarters for first-time winners – giving them the opportunity to network with industry professionals and fellow scholarship recipients, along with our top executives.

 

We also provide students with free courses, videos, informal mentorship, and virtual networking opportunities.

 

For schools, we provide free product apps, educational videos, opportunities to collaborate or support curriculum, and we are currently creating an online learning portal geared specifically toward universities and students.

 

Simpson Strong-Tie is committed to being a leader in providing educators and students with resources to help further education and industry knowledge.

Research Experiences for Undergraduates (REU) Program in Biopreservation Technologies

 The University of Minnesota (UMN) and Massachusetts General Hospital (MGH) invites undergraduates to gain real-world experience in conducting original research through the NSF Engineering Research Center for Advanced Technologies for the Preservation of Biological Systems.

Important Program Information:

Dates: June 7 - August 13, 2021
Locations: UMN (virtual) and MGH (in-person)
Duration: 10 weeks
Stipend: $5,000*
*for in-person projects, a travel and housing stipend is also provided
Application Deadline: March 1, 2021

Apply here: https://www.atp-bio-education.org/

Program Description
Students come from all around the country to engage in exciting cutting edge research with the technology’s greatest experts in biopreservation and cryobiology! Students have a diverse range of majors, experiences, and interests. We hope that you will consider joining us this summer.

REU students will work in a university research lab on a project related to ATP-Bio’s science and technology along with a faculty advisor and graduate student mentor. Each student has a project of their own with specific responsibilities and deliverables. The program features professional and skill development opportunities, as well as social activities.

Eligibility
Applicants must be U.S. Citizens, U.S. Nationals, or permanent residents of the United States. NSF and ATP-Bio is particularly interested in increasing the numbers of women, underrepresented minorities, and persons with disabilities in research.

Remote summer 2021 REU program at University of Pittsburgh/Human Engineering Research Laboratories - May 17th - July 22nd

 The University of Pittsburgh’s Human Engineering Research Laboratories (HERL) (www.herl.pitt.edu) will offer our REU program remotely this year from May 17^th – July 22nd.  We presented the program remotely last summer and it received very positive reviews from participants.

• American Student Placements in Rehabilitation Engineering (ASPIRE): https://www.herl.pitt.edu/education/undergrad/aspire 
• ASPIRE is a ten-week research program, sponsored by the National Science Foundation (NSF), that focuses on research in the rehabilitation engineering and assistive technology fields.  In addition to full participation in an on-going research project, students write a project paper, develop a poster, and compete in an elevator pitch competition.  The program concludes with Student Symposium where the winners of the best paper, poster, and elevator pitch are recognized. 

  

The ASPIRE REU program aligns with HERL’s mission to continuously improve the mobility and function of people with disabilities through advance engineering in clinical research and medical rehabilitation. Students in all areas (especially all engineering programs, math, and computer science) are encouraged to apply. The application deadline is Friday, March 12, 2021. 

  

Feel free to share the attached program flyer with any interested party. If you have any questions, do not hesitate to drop me line. 

  

Penn Engineering Summer Research Opportunity!

 

Application Deadline Monday, Feb. 1

The Center for Sensor Technologies at the University of Pennsylvania is offering Summer Fellowships for Undergraduate Students ending their freshman, sophomore, or junior year of college in engineering or science. The fellowships are funded by the National Science Foundation’s REU Program.

1. Summer research experience with a stipend of $6,000
   
2. Free housing & partial travel support
3. An opportunity to work on an interesting interdisciplinary topic
4. Mentorship from a Penn faculty member and a graduate student
5. A chance to learn how to give effective presentations, write technical reports, and apply to graduate school

SUNFEST Program Dates: June 1 – August 6, 2021
Requirements: Applicants must be US Citizens or Permanent Residents and have a minimum GPA of 3.0.
Apply Here. A copy of the flyer with details of the program can be found here. 

EERE HPC4Mfg Summer Internships

2021 EERE HPC4Mfg Summer Internships

 The U.S. Department of Energy (DOE) Office of Energy Efficiency & Renewable Energy (EERE) High Performance Computing for Manufacturing (HPC4Mfg) Internship Program is a 10-week summer internship program for students majoring in a field related to high performance computing.

 

Why should I apply?

As an intern, you will perform research-level computational activities and gain a competitive edge as you apply your education, talent, and skills to research and development projects focused on high performance computing (HPC). You will also be able to establish connections with DOE scientists and subject matter experts that promote long-term relationships between yourself, researchers, and DOE.

 

What are the benefits?

• Stipend
• Undergraduate students $600 per week
• Graduate students $750 per week
• Travel reimbursement up to $1,000, if eligible
• Housing allowance of $150/week, if eligible

 

Eligibility

• Be a U.S. citizen.
• Be at least 18 years old by May 1, 2021.
• Meet one of the following conditions:
• Recent graduate: Have earned an undergraduate or graduate degree in the past two years in a discipline related to high performance computing.
• Undergraduate Student: Be enrolled as a full-time student as a junior or senior at a U.S. accredited college or university during winter/spring 2021 and be pursuing a degree in a discipline related to high performance computing.
• Graduate Student: Be enrolled as a full-time graduate student at a U.S. accredited college or university during winter/spring 2021 and be pursuing a degree in a discipline related to high performance computing.

 

How to Apply

Applications and supporting materials must be submitted at

https://www.zintellect.com/Opportunity/Details/DOE-EERE-HPC-2021

 

Deadline

Application and recommendations are due February 1, 2021, 4:00 PM EST.

 

For more information

Contact us at HPC@orise.orau.gov.

 

The EERE HPC4Mfg Internship Program is sponsored by the Advanced Manufacturing Office (AMO).

Please share this information with friends and colleagues who may be interested in opportunities with DOE.

Intelligence Community Postdoctoral Research Fellowship Program now accepting applications!

 The Intelligence Community (IC) Postdoctoral Research Fellowship Program offers scientists and engineers from a wide variety of disciplines unique opportunities to conduct research in a wide range of topics relevant to the Intelligence Community. The research is conducted by the Postdocs, while working in partnership with a Research Advisor and collaborating with an advisor from the Intelligence Community.

The Program supports postdocs to conduct research at universities, colleges, and U.S. government laboratories throughout the United States.

In partnership with the Research Advisor, the Postdoc composes and submits a technical proposal that responds to a research opportunity identified at https://orise.orau.gov/icpostdoc/current-opportunities.html

Award Details:

·                     Stipends range from $75,000 to $79,000, depending on research location.

·                     Annual travel budget of up to $6,000

·                     Appointments for two years, and option to extend for a third year

·                     Host institutions receive an annual laboratory budget of up to $5,000. 

·                     Advisors receive a $10,000 stipend and travel budget of up to $2,000.

 

Postdoc Eligibility:

·                     U.S. citizenship required

·                     Ph.D. received within 5 years of the application deadline

 

Application Deadline: February 26, 2021